This technical document summarizes the applicable conditions of XAREC™ for SMT mounting, especially lead-free reflow soldering, together with the improvements achieved by newly developed grades.

The document explains that XAREC™ is applicable to lead-free wave soldering and that careful temperature-profile control is essential for reflow processing. It organizes the recommended peak temperature on the mounted board, the suggested solder composition, and the concept of reflow heat resistance. In the latter half, it presents the performance improvements of a newly developed grade in terms of heat resistance, shrinkage behavior, coplanarity, coefficient of linear thermal expansion, blister resistance, and surface condition.