This material introduction presents S145, a new XAREC™ grade developed for SMT reflow applications, with improved heat resistance, dimensional stability, coplanarity, and blister resistance.

Compared with the standard grade S136, S145 offers higher heat resistance, suppresses surface roughening and shrinkage after reflow, and improves coplanarity, which is critical for connector applications. The document also presents SMT header evaluations comparing terminal hole dimensions, outer dimensions, surface condition after terminal insertion, terminal retention force, and blister occurrence against other materials, positioning S145 as a well-balanced 40% glass-fiber-reinforced SPS grade for reflow soldering applications.